Datasheet

TLK2541
www.ti.com SLLS779B –JANUARY 2008– REVISED APRIL 2008
DISSIPATION RATINGS
(1)
T
A
≤ 25°C DERATING FACTOR T
A
= 70°C
PACKAGE
(2)
POWER RATING ABOVE T
A
= 25°C POWER RATING
PFP80
(3)
5.01 W 42.9 mW/°C 2.69 W
(1) This data was taken using 2 oz trace and copper pad that is soldered directly to a JEDEC standard 4 layer 3 in × 3 in PCB.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) Standard JEDEC High-K board.
For more information, refer to TI application note PowerPAD™ Thermally Enhanced package, TI literature
number SLMA002.
ELECTRICAL CHARACTERISTICS
over recommended operating conditions
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
V
DD
Supply voltage 2.3 2.5 2.7 V
Frequency = 1.25 Gbps, PRBS pattern 280
I
CC
Supply current mA
Frequency = 2.5 Gbps, PRBS pattern 310
Frequency = 1.25 Gbps, PRBS pattern 700
P
D
Power dissipation Frequency = 2.5 Gbps, PRBS pattern 775 mW
Frequency = 2.6 Gbps, worst case pattern
(1)
825
Low Power Mode current TX_CLK Static, V
DDA
and V
DD
= Max 1 mA
PLL startup lock time V
DD
, V
DDC
= 2.3 V 0.1 0.4 ms
Data acquisition time Frequency = 1.25 Gbps or 2.5 Gbps, K28.5 D16.2 256 ns
pattern (3 sigma values)
T
A
Operating free-air temperature –40 85 °C
(1) Worst case pattern is a pattern that creates a maximum transition density on the serial transceiver.
REFERENCE CLOCK (REFCLK)TIMING REQUIREMENTS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Frequency Minimum data rate Typ–0.01% 100 Typ+0.01% MHz
Frequency Maximum data rate Typ–0.01% 130 Typ+0.01% MHz
Frequency tolerance –100 100 ppm
Duty cycle 40% 50% 60%
Jitter Peak-to-peak 40 ps
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