Datasheet


     
SLLS574D − JULY 2003 − REVISED JULY 2007
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DOUTXN
DOUTXP
50%
80%
20%
80%
50%
20%
+ V
− V
0 V
80%
20%
DOUTXP
DOUTXN
t
r
t
f
t
r
t
r
t
f
t
f
Figure 9. Rise and Fall Time Definitions
thermal characteristics
PARAMETER TEST CONDITION MIN TYP MAX UNIT
R
θJA
Junction-to-free-air thermal resistance
Board mounted, no air flow, high conductivity T
I
recommended test board, chip soldered or greased to
21.47
°C/W
R
θJC
Junction-to-case thermal resistance
recommended test board, chip soldered or greased to
thermal land
0.38
°C/W
R
θJA
Junction-to-free-air thermal resistance
Board mounted, no air flow, high conductivity T
I
recommended test board with thermal land but no
42.2
°C/W
R
θJC
Junction-to-case thermal resistance
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
0.38
°C/W
R
θJA
Junction-to-free-air thermal resistance
Board mounted, no air flow, JEDEC test board
75.83
°C/W
R
θJC
Junction-to-case thermal resistance
Board mounted, no air flow, JEDEC test board
7.8
°C/W