Datasheet

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SLLS574D − JULY 2003 − REVISED JULY 2007
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
†
Supply voltage, V
DD
(see Note 1) −0.3 V to 3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range at TXD, ENABLE, GTX_CLK, LOOPEN, SYNC, PREEMPH −0.3 V to 4 V. . . . . . . . . . . . . . . . . . .
Voltage range at any other terminal except above −0.3 V to V
CC
+ 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package power dissipation, P
D
See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
−65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrostatic discharge HBM:2 kV, CDM:1.5 kV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Characterized free-air operating temperature range −40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead Temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground.
DISSIPATION RATING TABLE
PACKAGE
T
A
≤ 25°C
POWER RATING
DERATING FACTOR
†
ABOVE T
A
= 25°C
T
A
= 70°C
POWER RATING
PAP64
‡
3.22 W 32.15 mW/°C 1.77 W
PAP64
§
0.94 W 9.46 mW/°C 0.52 W
PAP64
¶
0.68 W 6.78 mW/°C 0.37 W
†
This is the inverse of the traditional junction-to-ambient thermal resistance (R
θJA
)
‡
High K-board with solder
§
High K-board without solder
¶
Low K-board
NOTE: For more information, see the TI application note PowerPAD Thermally Enhanced Package, TI (SLMA002).
electrical characteristics over recommended operating conditions
PARAMETER TEST CONDITION MIN TYP MAX UNIT
V
DD
Supply voltage 2.3 2.5 2.7 V
T
A
Operating free-air temperature −40 85 °C
I
CC
Supply current
V
DD
= 2.5 V, Freq = 1 Gb/sec, PRBS pattern 71
mA
I
CC
Supply current
V
DD
= 2.5 V, Freq = 2.5 Gb/sec, PRBS pattern
170
mA
V
DD
= 2.5 V, Freq = 1 Gb/sec, PRBS pattern 178
P
D
Power dissipation
V
DD
= 2.5 V, Freq = 2.5 Gb/sec, PRBS pattern
424
mW
P
D
Power dissipation
V
DD
= 2.75 V, Freq = 2.5 Gb/sec, worst case pattern 730
mW
Shutdown current ENABLE = 0, VDDA, VDD pins, V
DD
= max 130 µA
PLL startup lock time V
DD
, VDDA = 2.3 V, EN ↑ to PLL acquire 0.1 0.4 ms
Data acquisition time 1024 bits
reference clock (GTX_CLK) timing requirements over recommended operating conditions (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
R
Frequency
Minimum data rate TYP−0.01% 50 TYP+0.01% MHz
R
ω
Frequency
Maximum data rate
TYP−0.01% 125 TYP+0.01% MHz
Frequency tolerance −100 100 ppm
Duty cycle 40% 50% 60%
Jitter
#
Peak-to-peak 40 ps
#
See the Reference Lock Jitter Analysis For TLK2521 application note for more information.