Datasheet


    
SLLS427D − AUGUST 2000 − REVISED JULY 2003
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
built-in self-test (BIST)
The TLK2501 has a BIST function. By combining PRBS with loopback, an effective self-test of all the circuitry
running at full speed can be realized. The successful completion of the BIST is reported on the
RX_ER/PRBS_PASS terminal.
power-on reset
Upon application of minimum valid power, the TLK2501 generates a power-on reset. During the power-on reset
the RXD, RX_ER, and RX_DV/LOS signal terminals go to a high-impedance state. The RX_CLK is held low.
The length of the power-on reset cycle is dependent upon the REFCLK frequency, but is less than 1 ms.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
†
Supply voltage, V
DD
(see Note 1) −0.3 to 3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range at TXD, ENABLE, GTX_CLK, TX_EN, TX_ER, LOOPEN, PRBSEN, LCKREFN −0.3 to 4 V. . .
Voltage range at any other terminal except above −0.3 to V
DD
+0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package power dissipation, P
D
See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
−65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrostatic discharge HBM:3 KV, CDM:1.5 KV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Characterized free-air operating temperature range, T
A
−40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground.
DISSIPATION RATING TABLE
PACKAGE
T
A
≤25_C
POWER RATING
DERATING FACTOR
‡
ABOVE T
A
= 25_C
T
A
= 70_C
POWER RATING
RCP64
§
5.25 W 46.58 mW/_C 2.89 W
RCP64
¶
3.17 W 23.70 mW/_C 1.74 W
RCP64
#
2.01 W 13.19 mW/_C 1.11 W
‡
This is the inverse of the traditional junction-to-ambient thermal resistance (R
θJA
).
§
2 oz. Trace and copper pad with solder.
¶
2 oz. Trace and copper pad without solder.
#
Standard JEDEC High-K board.
For more information, refer to TI application note PowerPAD Thermally Enhanced Package, TI literature
number SLMA002.
electrical characteristics over recommended operating conditions
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
Supply voltage, V
DD
2.3 2.5 2.7 V
Supply current, I
CC
V
DD
= 2.5 V, Frequency = 1.5 Gbps, PRBS pattern 105
mA
Supply current, I
CC
V
DD
= 2.5 V, Frequency = 2.5 Gbps, PRBS pattern 145
mA
V
DD
= 2.5 V, Frequency = 1.5 Gbps, PRBS pattern 262 mW
Power dissipation, P
D
V
DD
= 2.5 V, Frequency = 2.5 Gbps, PRBS pattern 362 mW
Power dissipation, P
D
V
DD
= 2.7 V, Frequency = 2.5 Gbps, worst case pattern
||
500 mW
Shutdown current Enable = 0, V
DDA
+ V
DD
terminals = max 20 mA
PLL startup lock time V
DD
,V
DDA
= 2.3V, EN ↑ to PLL acquire 0.1 0.4 ms
Data acquisition time 1024 bits
Operating free-air temperature, T
A
−40 85 °C
||
Worst case pattern is a pattern that creates a maximum transition density on the serial transceiver.