Datasheet
Table Of Contents
- FEATURES
- DESCRIPTION
- DESCRIPTION (Continued)
- Differences Between TLK2201B, TLK2201BI, and TNETE2201
- BLOCK DIAGRAM
- DETAILED DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- DISSIPATION RATINGS
- THERMAL CHARACTERISTICS
- RECOMMENDED OPERATING CONDITIONS
- TLK2201B REFERENCE CLOCK (REFCLK) TIMING REQUIREMENTS
- TLK2201BI REFERENCE CLOCK (REFCLK) TIMING REQUIREMENTS
- TTL ELECTRICAL CHARACTERISTICS
- TRANSMITTER/RECEIVER CHARACTERISTICS
- LVTTL OUTPUT SWITCHING CHARACTERISTICS
- TRANSMITTER TIMING REQUIREMENTS
- APPLICATION INFORMATION
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GND
GNDA
TESTEN
TD0−TD9
REFCLK
PRBSEN
17
22
16
SYNCEN
24
SYNC/PASS
47
10
10
RD0−RD9
2
RBC0−RBC1
ENABLE
28
TCK
49
JTMS
55
JTDI
48
JTRSTN
56
JTDO
27
LOS
26
RBCMODE
32
LOOPEN
19
MODESEL
15
Host
Protocol
Device
JTAG
Controller
VDD VDDA
2.5V
VDDPLL
GNDPLL
5 Ω at100MHz
2.5V
64
18
62
Controlled Impedance
TransmissionLine
TXP
61
ControlledImpedance
TransmissionLine
TXN
54
ControlledImpedance
TransmissionLine
RXP
52
ControlledImpedance
TransmissionLine
RXN
R
t
R
t
50 Ω
50 Ω
TLK2201B
TLK2201BI
0.01 µF
DESIGNING WITH PowerPAD
TLK2201B
TLK2201BI
SLLS585C – NOVEMBER 2003 – REVISED FEBRUARY 2008
Figure 12. Typical Application Circuit (AC mode)
The TLK2201B and TLK2201BI are housed in a high performance, thermally enhanced, 64-pin VQFP (RCP64)
PowerPAD package. Use of the PowerPAD package does not require any special considerations except to note
that the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical
conductor. Therefore, if not implementing PowerPAD PCB features, the use of solder masks (or other assembly
techniques) may be required to prevent any inadvertent shorting by the exposed PowerPAD of connection etches
or vias under the package. It is strongly recommended that the PowerPAD be soldered to the thermal land. The
recommended convention, however, is to not run any etches or signal vias under the device, but to have only a
grounded thermal land as explained below. Although the actual size of the exposed die pad may vary, the
minimum size required for the keepout area for the 64-pin PFP PowerPAD package is 8 mm × 8 mm.
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the
PowerPAD package. The thermal land varies in size depending on the PowerPAD package being used, the PCB
construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may not
contain numerous thermal vias depending on PCB construction.
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