Datasheet

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ABSOLUTE MAXIMUM RATINGS
(1)
DISSIPATION RATINGS
(1)
THERMAL CHARACTERISTICS
TLK2201B
TLK2201BI
SLLS585C – NOVEMBER 2003 – REVISED FEBRUARY 2008
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
V
DD
Supply voltage
(2)
– 0.3 to 3 V
V
I
Input voltage range at TTL terminals – 0.5 to 4 V
Input voltage range at any other terminal – 0.3 to V
DD
+0.3 V
T
stg
Storage temperature – 65 to 150 ° C
CDM 1 kV
Electrostatic discharge
HDM 2 kV
TLK2201B 0 to 70 ° C
Characterized free-air operating temperature range
TLK2201BI – 40 to 85 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
OPERATING
T
A
≤ 25 ° C TA = 70 ° C
PACKAGE FACTOR
(2)
POWER RATING POWER RATING
ABOVE T
A
= 25 ° C
RCP64
(3)
5.25 W 46.58 mW/ ° C 2.89 W
RCP64
(4)
3.17 W 23.70 mW/ ° C 1.74 W
RCP64
(5)
2.01 W 13.19 mW/ ° C 1.11 W
(1) For more information, refer to TI application note PowerPAD Thermally Enhanced Package
(SLMA002 ).
(2) This is the inverse of the traditional junction-to-ambient thermal resistance (R
θ JA
).
(3) 2 oz. Trace and copper pad with solder.
(4) 2 oz. Trace and copper pad without solder.
(5) Standard JEDEC high-K board
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased 21.47
to thermal land
R
θ JA
Junction-to-free-air thermal resistance Board-mounted, no air flow, high conductivity TI ° C/W
recommended test board with thermal land but no 42.20
solder or grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board 75.83
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased 0.38
to thermal land
R
θ JC
Junction-to-case-thermal resistance Board-mounted, no air flow, high conductivity TI ° C/W
recommended test board with thermal land but no 0.38
solder or grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board 7.8
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