Datasheet

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    
SLLS428F − JUNE 2000 − REVISED JANUARY 2004
19
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
THERMAL INFORMATION
PARAMETER TEST CONDITION MIN TYP MAX UNIT
Board-mounted, no air flow, high conductivity TI recommended test
board, chip soldered or greased to thermal land
21.47
R
θJA
Junction-to-free-air
thermal resistance
Board-mounted, no air flow, high conductivity TI recommended test
board with thermal land but no solder or grease thermal connection to
thermal land
42.20
°C/W
Board-mounted, no air flow, JEDEC test board 75.83
Board-mounted, no air flow, high conductivity TI recommended test
board, chip soldered or greased to thermal land
0.38
R
θJC
Junction-to-case therma
l
resistance
Board-mounted, no air flow, high conductivity TI recommended test
board with thermal land but no solder or grease thermal connection to
thermal land
0.38
°C/W
Board-mounted, no air flow, JEDEC test board 7.8