Datasheet


    
SLLS428F − JUNE 2000 − REVISED JANUARY 2004
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
†
Supply voltage, V
DD
(see Note 1) −0.3 to 3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range at TXD, ENABLE, GTX_CLK, TX_EN, TX_ER, LOOPEN, PRBS_PASS −0.3 to 4 V. . . . . . . . . .
Voltage range at any other terminal except above −0.3 to V
DD
+0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package power dissipation, P
D
See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
−65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrostatic discharge HBM:3 KV, CDM:1.5 KV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Characterized free-air operating temperature range, T
A
−40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground.
DISSIPATION RATING TABLE
PACKAGE
T
A
≤25_C
POWER RATING
DERATING FACTOR
‡
ABOVE T
A
= 25_C
T
A
= 70_C
POWER RATING
RCP64
§
5.25 W 46.58 mW/_C 2.89 W
RCP64
¶
3.17 W 23.70 mW/_C 1.74 W
RCP64
#
2.01 W 13.19 mW/_C 1.11 W
‡
This is the inverse of the traditional junction-to-ambient thermal resistance (R
θJA
).
§
2 oz. Trace and copper pad with solder.
¶
2 oz. Trace and copper pad without solder.
#
Standard JEDEC High-K board.
For more information, refer to TI application note PowerPAD Thermally Enhanced Package, TI literature
number SLMA002.
electrical characteristics over recommended operating conditions
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
Supply voltage, V
DD
2.3 2.5 2.7 V
Supply current, I
CC
V
DD
= 2.5 V, Frequency = 0.6 Gbps, PRBS pattern 70
mA
Supply current, I
CC
V
DD
= 2.5 V, Frequency = 1.5 Gbps, PRBS pattern 100
mA
V
DD
= 2.5 V, Frequency = 0.6 Gbps, PRBS pattern 175 mW
Power dissipation, P
D
V
DD
= 2.5 V, Frequency = 1.5 Gbps, PRBS pattern 250 mW
Power dissipation, P
D
V
DD
= 2.5 V, Frequency = 1.5 Gbps, worst case pattern
||
350 mW
Shutdown current Enable = 0, V
DDA
+ V
DD
terminals = max 2 mA
PLL startup lock time V
DD
,V
DDA
= 2.3V, EN ↑ to PLL acquire 0.1 0.4 ms
Data acquisition time 1024 bits
Operating free-air temperature, T
A
−40 85 °C
||
Worst case pattern is a pattern that creates a maximum transition density on the serial transceiver.
reference clock (GTX_CLK) timing requirements over recommended operating conditions (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Frequency Minimum data rate Typ−0.01% 30 Typ+0.01% MHz
Frequency Maximum data rate Typ−0.01% 75 Typ+0.01% MHz
Frequency tolerance −100 ppm
Duty cycle 40% 50% 60%
Jitter Peak-to-peak 40 ps