Datasheet

3-3
PCB Construction and Characteristics
Figure 3–1. TLK1501 EVM Layer Construction
Layer 1 Top 50 Ω
GND1
14 Mil
Layer 2
5 Mil
Layer 3
V
DD1
V
DD2
21 Mil
Layer 4
05 Mil
Layer 5
Solder 50 Ω
GND2
07 Mil
Layer 6
Notes:
1) All cores consist of 1 oz. Cu.
2) Trace width
A) 25 mils (for 50 Ω Layer 1)
B) 11.8 mils (for 50 Ω Layer 6)
3) Overall board thickness is 62 mils ±5 mil
4) Copper and solder mask adds approximately 10 mils to the overall board thickness.
5) Impedance is 50 Ω ±5%
6) Material is G-Tek. Dielectric constant = 3.9
7) For overall thickness: add 1.2 to 1.4 mils for each metal layer in the stack-up.