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Schematic, Bill of Materials, and Board Layouts
Table 4. TLK1221 EVM PCB Layer Construction
Thickness Conductivity Dielectric Loss Width Impedance
Subclass Name Type Material Artwork
(MIL) (mho/cm) Constant Tangent (MIL) ( Ω )
SURFACE AIR
TOP CONDUCTOR COPPER 2.4 595900 1 0 POSITIVE 8 49.307
DIELECTRIC FR-4 4.5 0 4.1 0.035
L2_GND PLANE COPPER 1.2 595900 1 0 NEGATIVE
DIELECTRIC FR-4 7.5 0 4.1 0.035
L3_SIG CONDUCTOR COPPER 1.2 595900 1 0 POSITIVE 6.5 50.349
DIELECTRIC FR-4 7.5 0 4.1 0.035
L4_GND PLANE COPPER 1.2 595900 1 0 NEGATIVE
DIELECTRIC FR-4 7.5 0 4.1 0.035
L5_SIG/VDDPLL CONDUCTOR COPPER 1.2 595900 1 0 POSITIVE 6.5 50.349
DIELECTRIC FR-4 7.5 0 4.1 0.035
L6_GND PLANE COPPER 1.2 595900 1 0 NEGATIVE
DIELECTRIC FR-4 7.5 0 4.1 0.035
L7_VDD/VDDA PLANE COPPER 1.2 595900 1 0 NEGATIVE
DIELECTRIC FR-4 7.5 0 4.1 0.035
L8_GND PLANE COPPER 1.2 595900 1 0 NEGATIVE
DIELECTRIC FR-4 7.5 0 4.1 0.035
L9_GND PLANE COPPER 1.2 595900 1 0 NEGATIVE
DIELECTRIC FR-4 4.5 0 4.1 0.035
BOTTOM CONDUCTOR COPPER 2.4 595900 1 0 POSITIVE 8 49.307
SURFACE AIR
Note: Always consult with your board manufacturer for their process/design requirements to ensure
the desired impedance is achieved.
18 TLK1221 Ethernet Transceiver Evaluation Module (EVM) SLLU100 – September 2007
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