Datasheet

TLK1211RCP
SLLS658D – SEPTEMBER 2006– REVISED APRIL 2011 www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
TLK1211RCP
Supply voltage, V
DD
(see
(2)
) –0.3 V to 3 V
Input voltage range at TTL terminals, V
I
–0.5 V to 4 V
Input voltage range at any other terminal –0.3 V to V
DD
+0.3 V
Storage temperature, T
stg
–65°C to 150°C
Electrostatic discharge CDM: 1 kV, HBM:4 kV
Characterized free-air operating temperature range TLK1211RCP –40°C to 85°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
DISSIPATION RATING TABLE
T
A
≤25°C OPERATING FACTOR
(1)
T
A
= 70°C
PACKAGE
POWER RATING ABOVE T
A
= 25°C POWER RATING
RCP64
(2)
5.25 W 46.58 mW/°C 2.89 W
RCP64
(3)
3.17 W 23.70 mW/°C 1.74 W
RCP64
(4)
2.01 W 13.19 mW/°C 1.11 W
(1) This is the inverse of the traditional junction-to-ambient thermal resistance (R
θJA
).
(2) 2 oz. Trace and copper pad with solder
(3) 2 oz. Trace and copper pad without solder
(4) Standard JEDEC high-K board
Table 3. Thermal Characteristics
PARAMETER TEST CONDITION MIN TYP MAX UNIT
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to 21.47
thermal land
Junction-to-free-air thermal
R
θJA
Board-mounted, no air flow, high conductivity TI °C/W
resistance
recommended test board with thermal land but no solder or 42.2
grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board 75.83
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to 0.38
thermal land
Junction-to-case-thermal
R
θJC
Board-mounted, no air flow, high conductivity TI °C/W
resistance
recommended test board with thermal land but no solder or 0.38
grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board 7.8
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