Datasheet
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
DISSIPATION RATING TABLE
TLK1201ARCP , TLK1201AIRCP
ETHERNET TRANSCEIVERS
SLLS580D – FEBRUARY 2004 – REVISED SEPTEMBER 2007
over operating free-air temperature range (unless otherwise noted)
TLK1201A/TLK1201AI
Supply voltage, V
DD
(see
(2)
) – 0.3 V to 3 V
Input voltage range at TTL terminals, V
I
– 0.5 V to 4 V
Input voltage range at any other terminal – 0.3 V to V
DD
+0.3 V
Storage temperature, T
stg
– 65 ° C to 150 ° C
Electrostatic discharge CDM: 1 kV, HBM:2 kV
TLK1201A 0 ° C to 70 ° C
Characterized free-air operating temperature range
TLK1201AI – 40 ° C to 85 ° C
(1) Stresses beyond those listed under “ absolute maximum ratings ” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “ recommended operating
conditions ” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
T
A
≤ 25 ° C OPERATING FACTOR
(1)
T
A
= 70 ° C
PACKAGE
POWER RATING ABOVE T
A
= 25 ° C POWER RATING
RCP64
(2)
5.25 W 46.58 mW/ ° C 2.89 W
RCP64
(3)
3.17 W 23.70 mW/ ° C 1.74 W
RCP64
(4)
2.01 W 13.19 mW/ ° C 1.11 W
(1) This is the inverse of the traditional junction-to-ambient thermal resistance (R
Θ JA
).
(2) 2 oz. Trace and copper pad with solder
(3) 2 oz. Trace and copper pad without solder
(4) Standard JEDEC high-K board
Thermal Characteristics
PARAMETER TEST CONDITION MIN TYP MAX UNIT
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to 21.47
thermal land
Junction-to-free-air thermal
R
Θ JA
Board-mounted, no air flow, high conductivity TI ° C/W
resistance
recommended test board with thermal land but no solder or 42.2
grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board 75.83
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to 0.38
thermal land
Junction-to-case-thermal
R
Θ JC
Board-mounted, no air flow, high conductivity TI ° C/W
resistance
recommended test board with thermal land but no solder or 0.38
grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board 7.8
10 Submit Documentation Feedback Copyright © 2004 – 2007, Texas Instruments Incorporated
Product Folder Link(s): TLK1201ARCP TLK1201AIRCP