Datasheet
TLK110
SLLS901D –DECEMBER 2011–REVISED JANUARY 2014
www.ti.com
9 Electrical Specifications
All parameters are derived by test, statistical analysis, or design.
9.1 ABSOLUTE MAXIMUM RATINGS
(1)
VALUE UNIT
VDD_IO, AVDD33 Supply voltage –0.3 to 3.8 V
PFBIN1, PFBIN2 –0.3 to 1.8
XI DC Input voltage –0.3 to 3.8 V
TD-, TD+, RD-, RD+ –0.3 to 6
Other Inputs –0.3 to 3.8
XO DC Output voltage –0.3 to 3.8 V
Other outputs –0.3 to 3.8
T
J
Maximum die temperature 125 °C
T
S
Storage Temperature –65 to 150 °C
Human-Body All pins
(2)
±4 kV
Model
Ethernet network pins (TD+, TD-, RD+, RD-)
(3)
±16
ESD
Charged-Device All pins
(4)
±750 V
Model
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Tested in accordance to JEDEC Standard 22, Test Method A114.
(3) Test method based upon JEDEC Standard 22 Test Method A114, Ethernet network pins (TD+, TD-, RD+, RD-) pins stressed with
respect to GND.
(4) Tested in accordance to JEDEC Standard 22, Test Method C101.
9.2 RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
Dual Supply Operation
Core Supply voltage (PFBIN1, PFBIN2) 1.48 1.55 1.68 V
P
D
Power dissipation
(1)
200 mW
Single Supply Operation
(PFBOUT connected to PFBIN1, PFBIN2 See Figure 3-1)
P
D
Power dissipation
(2)
270 mW
AVDD33 Analog 3.3V Supply 3.0 3.3 3.6 V
3.3V Option 3.0 3.3 3.6
VDD_IO 2.5V Option 2.25 2.5 2.75 V
1.8V Option (MII Mode only) 1.62 1.8 1.98
T
A
Ambient TLK110PT –40 85
°C
temperature
P
D
Power dissipation
(2)
200 mW
(1) For 100Base-TX
(2) For 100Base-TX, When internal 1.55V is used. Device is operated from single 3.3V supply only.
9.3 48-Pin Industrial Device Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER CONDITIONS MIN TYP MAX UNIT
θ
JA
Junction-to-ambient thermal resistance (no airflow) JEDEC high-K model 65.3
θ
JB
Junction-to-board thermal resistance 28.5 °C/W
θ
JC
Junction-to-case thermal resistance 23.1
78 Electrical Specifications Copyright © 2011–2014, Texas Instruments Incorporated
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