Datasheet

TLK105
TLK106
SLLSEB8A –AUGUST 2012–REVISED MARCH 2013 www.ti.com
9 Electrical Specifications
All parameters are derived by test, statistical analysis, or design.
9.1 ABSOLUTE MAXIMUM RATINGS
(1)
VALUE UNIT
VDD33_IO, AVDD33 Supply voltage –0.3 to 3.8 V
PFBIN1, PFBIN2 –0.3 to 1.8
XI DC Input voltage –0.3 to 3.8 V
TD-, TD+, RD-, RD+ –0.3 to 6
Other Inputs –0.3 to 3.8
XO DC Output voltage –0.3 to 3.8 V
Other outputs –0.3 to 3.8
T
J
Maximum die temperature 125 °C
Human-Body All pins
(2)
±4 kV
Model
Ethernet network pins (TD+, TD-, RD+, RD-)
(3)
±16
ESD
Charged-Device All pins
(4)
±750 V
Model
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Tested in accordance to JEDEC Standard 22, Test Method A114.
(3) Test method based upon JEDEC Standard 22 Test Method A114, Ethernet network pins (TD+, TD-, RD+, RD-) pins stressed with
respect to GND.
(4) Tested in accordance to JEDEC Standard 22, Test Method C101.
9.2 RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
VDD33_IO, AVDD33 I/O and Analog 3.3V Supply 3.0 3.3 3.6 V
PFBIN1, PFBIN2 Core Supply voltage 1.47 1.55 1.62 V
T
A
Ambient TLK105 –40 85
°C
temperature
(1)
TLK106 –40 105
P
D
Power dissipation
(2)
270 mW
(1) Provided that DOWN_PAD, pin 33, is soldered down. See Thermal Vias Recommendation for more detail.
(2) For 100Base-TX, When internal 1.55V is used. Device is operated from single 3.3V supply only.
9.3 THERMAL CHARACTERISTICS
9.3.1 TLK105 32-Pin Industrial Device (85°C) Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER CONDITIONS MIN TYP MAX UNIT
θ
JA
Junction-to-ambient thermal resistance (no airflow) JEDEC high-K model 36.4
θ
JB
Junction-to-board thermal resistance 9.3
°C/W
θ
JC(Top)
Junction-to-case thermal resistance, Top 26.8
θ
JC(Bottom)
Junction-to-case thermal resistance, Bottom 1.7
9.3.2 TLK106 32-Pin Extended Temperature (105°C) Device Thermal Characteristics
74 Electrical Specifications Copyright © 2012–2013, Texas Instruments Incorporated
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