Datasheet

TLK100
www.ti.com SLLS931B–AUGUST 2009–REVISED DECEMBER 2009
9 Electrical Specifications
All parameters are derived by test, statistical analysis, or design.
9.1 ABSOLUTE MAXIMUM RATINGS
(1)
VALUE UNIT
VDD33_IO, VDD33_VA11, Supply voltage –0.3 to 3.8 V
VDD33_V18, VDD33_VD11
V18_PFBIN1, V18_PFBIN2 –0.3 to 2.2 V
VA11_PFBIN1, VA11_PFBIN2 –0.3 to 1.8 V
XI DC Input voltage –0.3 to 2.2 V
TD-, TD+, RD-, RD+ –0.3 to 6 V
Other Inputs –0.3 to 3.8 V
XO DC Output voltage –0.3 to 2.2 V
Other outputs –0.3 to 3.8 V
Maximum die temperature θ
J
105 °C
IEC 60749-26 ESD (human-body model)
(2)
±16 kV
JEDEC Standard 22, Test Method A114 (human-body model)
(2)
±16
ESD
JEDEC Standard 22, Test Method A114 (human-body model), all pins 1.5
JEDEC Standard 22, Test Method C101 (charged-device model), all pins 1.5
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) On pins TD+, TD-, RD+, RD-, with VDD33_IO, VDD33_VA11 VDD33_V18, VDD33_VD11, V18_PFBIN1, V18_PFBIN2, VA11_PFBIN1,
VA11_PFBIN2, VA11_PFBOUT, V18_PFBOUT, VDD11, VSS connected to ground potential.
9.2 THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
θ
JA
Junction-to-ambient thermal resistance (no airflow) 26.8
θ
JB
Junction-to-board thermal resistance 16.2 °C/W
θ
JC
Junction-to-case thermal resistance 40
9.3 RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
VDD33_VA11,VDD33_V18, Core Supply voltage 2.38 3.3 3.6 V
VDD33_VD11
VDD33_IO I/O 3.3V Supply 3.0 3.3 3.6 V
V18_PFBIN1, External Supply
(1)
1.7 1.8 1.9 V
V18_PFBIN2
VA11_PFBIN1, 1.04 1.1 1.15 V
VA11_PFBIN2
T
A
Ambient temperature
(2)
–40 85 °C
P
D
Power dissipation
(3)
189 mW
(1) When the internal voltage regulator is not used and the external supply is used
(2) Provided that GNDPAD, pin 49, is soldered down. See Thermal Vias Recommendation for more detail.
(3) For 100Base-TX, When external 1.8V, 1.1 and 3.3V supplies are used.
Copyright © 2009, Texas Instruments Incorporated Electrical Specifications 69
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