Datasheet

TLK10034 EVM SMA Breakout Board Layout

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Table 2. TLK10034 EVM SMA Breakout Board Layer Construction

Subclass Dielectric Coupling Type /

Type Material Thickness (MIL) Width (MIL)

Name Constant Spacing (MIL)

SURFACE AIR 1

TOP CONDUCTOR COPPER 2 1 6.00 (Diff) Edge / 5.0 (Diff)

9.5 (Single) None/None

(Single)

DIELECTRIC FR-4 5 4.5

L2_GND PLANE COPPER 1.2 1

DIELECTRIC FR-4 20 4.5

L3_GND PLANE COPPER 1.2 1 6.50 (Single) None/None

(Single)

DIELECTRIC FR-4 4 4.5

L4_GND PLANE COPPER 1.2 1

DIELECTRIC FR-4 20 4.5

BOTTOM CONDUCTOR COPPER 2 1 6.00 (Diff) None/None

9.5 (Single) (Single)

Edge / 5.0 (Diff)

SURFACE AIR

NOTE: The impedance is set at slightly less than 50 or 100 Ω on the traces to compensate for slight

over-etching during the manufacturing process. The end impedance after etching should

result in a 50- or 100-Ω impedance. Always consult with your board manufacturer for their

process and design requirements, ensuring the desired impedance is achieved.

TLK10034 Quad-Channel XAUI/10GBASE-KR Transceiver Evaluation SLLU168–August 2012

Module (EVM)

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