Datasheet

www.ti.com TLK10034 EVM Motherboard Layout
Table 1. TLK10034 EVM Motherboard Layer Construction
Subclass Coupling Type /
Type Material Thickness (MIL) Dielectric Constant Width (MIL)
Name Spacing (MIL)
SURFACE AIR 1
TOP CONDUCTOR COPPER 2 1 3.75 (Diff) Edge / 4.0 (Diff)
11.25 (Single) None/None (Single)
DIELECTRIC Rogers 6.6 3.7
L2_GND PLANE COPPER 1.2 1
DIELECTRIC FR-4 8 4.5
L3_SIG2 CONDUCTOR COPPER 1.2 1 6.50 (Single) None/None (Single)
DIELECTRIC FR-4 8 4.5
L4_GND PLANE COPPER 1.2 1
DIELECTRIC FR-4 5 4.5
L5_PWR CONDUCTOR COPPER 1.2 1 6.50 (Single) None/None (Single)
DIELECTRIC FR-4 5 4.5
L6_GND PLANE COPPER 1.2 1
DIELECTRIC FR-4 5 4.5
L7_PWR PLANE COPPER 1.2 1
DIELECTRIC FR-4 5 4.5
L8_GND PLANE COPPER 1.2 1
DIELECTRIC FR-4 5 4.5
L9_SIG CONDUCTOR COPPER 1.2 1 6.50 (Single) None/None (Single)
DIELECTRIC FR-4 5 4.5
L10_SIG CONDUCTOR COPPER 1.2 1 6.50 (Single) None/None (Single)
DIELECTRIC FR-4 5 4.5
L11_GND PLANE COPPER 1.2 1
DIELECTRIC FR-4 5 4.5
L12_PWR CONDUCTOR COPPER 1.2 1 6.50 (Single) None/None (Single)
DIELECTRIC FR-4 5 4.5
L13_GND PLANE COPPER 1.2 1
DIELECTRIC FR-4 5 4.5
L14_PWR PLANE COPPER 1.2 1
DIELECTRIC FR-4 5 4.5
L15_GND PLANE COPPER 1.2 1
DIELECTRIC FR-4 8 4.5
L16_SIG CONDUCTOR COPPER 1.2 1 6.50 (Single) None/None (Single)
DIELECTRIC FR-4 8 4.5
L17_GND PLANE COPPER 1.2 1
DIELECTRIC Rogers 6.6 3.7
BOTTOM CONDUCTOR COPPER 2 1 3.75 (Diff) Edge / 4.0 (Diff)
11.25 (Single) None/None (Single)
SURFACE AIR
NOTE: The impedance is set at slightly less than 50 or 100 Ω on the traces to compensate for slight
over-etching during the manufacturing process. The end impedance after etching should
result in a 50- or 100-Ω impedance. Always consult with your board manufacturer for their
process and design requirements, ensuring the desired impedance is achieved.
45
SLLU168–August 2012 TLK10034 Quad-Channel XAUI/10GBASE-KR Transceiver Evaluation
Module (EVM)
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