Datasheet

TLK10002EVM SMA Breakout Board Layout

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Table 6. TLK10002EVM SMA Breakout Board Layer Construction

SUBCLASS THICKNESS DIELECTRIC LOSS WIDTH COUPLING TYPE/SPACING IMPEDANCE

(1)

TYPE MATERIAL

NAME (MIL) CONSTANT TANGENT (MIL) (MIL) (Ω)

SURFACE AIR 1 0

TOP CONDUCTOR COPPER 1.96 4.1 0 6.00 Edge/5.00 97.298

DIELECTRIC FR-4 5 4.1 0.035

L2_GND1 PLANE COPPER 1.2 1 0

DIELECTRIC FR-4 5 4.1 0.035

L3_GND2 PLANE COPPER 1.2 1 0

DIELECTRIC FR-4 4 4.1 0.035

L4_GND3 PLANE COPPER 1.2 1 0

DIELECTRIC FR-4 20 4.1 0.035

L13_GND4 PLANE COPPER 1.2 1 0

DIELECTRIC FR-4 5 4.1 0.035

BOTTOM CONDUCTOR COPPER 1.96 1 0 9.50 NONE/NONE 48.425

SURFACE AIR

(1)

The Impedance is set to be slightly less than 50 Ω or 100 Ω on the traces in order to compensate for slight over-etching during the

manufacturing process. The end impedance after etching should result in a 50 or 100-Ω Impedance. Always consult with your board

manufacturer for their process/design requirements to ensure the desired impedance is achieved.

TLK10002 Dual-Channel, 10-Gbps, Multi-Rate Transceiver Evaluation Module SLLU148– May 2011

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