Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
AMFKB
TLE2161AMJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9095802QPA
TLE2161AM
TLE2161BCP OBSOLETE PDIP P 8 TBD Call TI Call TI 0 to 70
TLE2161BIP OBSOLETE PDIP P 8 TBD Call TI Call TI
TLE2161BMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9095803Q2A
TLE2161
BMFKB
TLE2161BMJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 TLE2161
BMJG
TLE2161BMJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9095803QPA
TLE2161BM
TLE2161BMP OBSOLETE PDIP P 8 TBD Call TI Call TI -55 to 125
TLE2161CD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 2161C
TLE2161CDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 2161C
TLE2161CP OBSOLETE PDIP P 8 TBD Call TI Call TI 0 to 70
TLE2161ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 2161I
TLE2161IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 2161I
TLE2161IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 2161I
TLE2161IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 2161I
TLE2161IP OBSOLETE PDIP P 8 TBD Call TI Call TI
TLE2161MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9095801Q2A
TLE2161
MFKB
TLE2161MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9095801QPA
TLE2161M
TLE2161MP OBSOLETE PDIP P 8 TBD Call TI Call TI -55 to 125