Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9095801Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9095801Q2A
TLE2161
MFKB
5962-9095801QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9095801QPA
TLE2161M
5962-9095802Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9095802Q2A
TLE2161
AMFKB
5962-9095802QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9095802QPA
TLE2161AM
5962-9095803Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9095803Q2A
TLE2161
BMFKB
5962-9095803QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9095803QPA
TLE2161BM
TLE2161ACD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 2161AC
TLE2161ACDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 2161AC
TLE2161ACP OBSOLETE PDIP P 8 TBD Call TI Call TI 0 to 70
TLE2161AID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 2161AI
TLE2161AIDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 2161AI
TLE2161AIDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 2161AI
TLE2161AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 2161AI
TLE2161AIP OBSOLETE PDIP P 8 TBD Call TI Call TI
TLE2161AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9095802Q2A
TLE2161