Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLE2141AIDR SOIC D 8 2500 340.5 338.1 20.6
TLE2141CDR SOIC D 8 2500 340.5 338.1 20.6
TLE2141IDR SOIC D 8 2500 340.5 338.1 20.6
TLE2141MDR SOIC D 8 2500 367.0 367.0 35.0
TLE2142ACDR SOIC D 8 2500 340.5 338.1 20.6
TLE2142AIDR SOIC D 8 2500 340.5 338.1 20.6
TLE2142AMDR SOIC D 8 2500 367.0 367.0 35.0
TLE2142AMDRG4 SOIC D 8 2500 367.0 367.0 35.0
TLE2142CDR SOIC D 8 2500 340.5 338.1 20.6
TLE2142CPWR TSSOP PW 16 2000 367.0 367.0 35.0
TLE2142IDR SOIC D 8 2500 340.5 338.1 20.6
TLE2142MDR SOIC D 8 2500 367.0 367.0 35.0
TLE2142MDRG4 SOIC D 8 2500 367.0 367.0 35.0
TLE2144CDWR SOIC DW 16 2000 367.0 367.0 38.0
TLE2144IDWR SOIC DW 16 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Mar-2013
Pack Materials-Page 2