Datasheet

TLE208x, TLE208xA, TLE208xY
EXCALIBUR HIGH-SPEED JFET-INPUT
OPERATIONAL AMPLIFIERS
SLOS182B – FEBRUARY 1997 – REVISED JUNE 2001
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLE2081 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
CHIP
FORM
(Y)
0°Cto70°C
3 mV TLE2081ACD TLE2081ACP —
0°C
to
70°C
6 mV TLE2081CD
— —
TLE2081CP TLE2081Y
40°Cto85°C
3 mV TLE2081AID TLE2081AIP
–
40°C
to
85°C
6 mV TLE2081ID
— —
TLE2081IP
—
55°Cto125°C
3 mV TLE2081AMFK TLE2081AMJG
–
55°C
to
125°C
6 mV
—
TLE2081MFK TLE2081MJG
— —
†
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2081ACDR).
‡
Chip forms are tested at T
A
= 25°C only.
TLE2082 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
CHIP FORM
(Y)
0°Cto70°C
4 mV TLE2082ACD TLE2082ACP
0°C
to
70°C
7 mV TLE2082CD
— —
TLE2082CP
—
40
°
Cto85
°
C
4 mV TLE2082AID TLE2082AIP
TLE2082Y
–
40°C
to
85°C
7 mV TLE2082ID
— —
TLE2082IP
TLE2082Y
55°Cto125°C
4 mV TLE2082AMD TLE2082AMFK TLE2082AMJG TLE2082AMP
–
55°C
to
125°C
7 mV TLE2082MD TLE2082MFK TLE2082MJG TLE2082MP
—
‡
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2082ACDR).
‡
Chip forms are tested at T
A
= 25°C only.
TLE2084 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(DW)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
CHIP
FORM
(Y)
0
°
Cto70
°
C
4 mV TLE2084ACDW TLE2084ACN —
0°C
to
70°C
7 mV TLE2084CDW
— —
TLE2084CN TLE2084Y
55°Cto125°C
4 mV TLE2084AMFK TLE2084AMJ
–
55°C
to
125°C
7 mV
—
TLE2084MFK TLE2084MJ
— —
†
The DW packages are available taped and reeled. Add R suffix to device type (e.g., TLE2084ACDWR).
‡
Chip forms are tested at T
A
= 25°C only.