Datasheet

TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION OPERATIONAL AMPLIFIERS

SLOS192C − FEBRUARY 1997 − REVISED APRIL 2010
3
TLE202xY chip information
This chip, when properly assembled, displays characteristics similar to the TLE202xC. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(1) (2) (3)
(4)
(5)
(6)
(7)(8)
90
73
(1)
(2)
(3)
(4)
(6)
(7)
(8)
+
−
OUT
IN+
IN−
V
CC+
V
CC −
OFFSET N1
OFFSET N2
(1)
(3)
(2)
(8)
(7)
(4)
(6)