Datasheet

TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS

SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLE2024Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2024. Thermal compression or
ultrasonic bonding may be used on the doped aluminum-bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
−
1OUT
1IN+
1IN−
V
CC +
(4)
(6)
(3)
(2)
(5)
(1)
−
+
(7)
2IN+
2IN−
2OUT
(11)
V
CC − /GND
+
−
3OUT
2IN+
3IN−
(13)
(10)
(9)
(12)
(8)
−
+
(14)
4OUT
4IN+
4IN−
100
140