Datasheet

Device Package

Type

Package

Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)

Pin1

Quadrant

TLC7733QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

TLC7733QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TLC7701IDR SOIC D 8 2500 367.0 367.0 35.0

TLC7701IDRBT-NM SON DRB 8 250 210.0 185.0 35.0

TLC7701IPWR TSSOP PW 8 2000 367.0 367.0 35.0

TLC7701QDR SOIC D 8 2500 367.0 367.0 35.0

TLC7701QPWR TSSOP PW 8 2000 367.0 367.0 35.0

TLC7703IDR SOIC D 8 2500 367.0 367.0 35.0

TLC7703IPWR TSSOP PW 8 2000 367.0 367.0 35.0

TLC7705IDR SOIC D 8 2500 367.0 367.0 35.0

TLC7705IPWR TSSOP PW 8 2000 367.0 367.0 35.0

TLC7705QDR SOIC D 8 2500 367.0 367.0 35.0

TLC7705QPWR TSSOP PW 8 2000 367.0 367.0 35.0

TLC7725IDR SOIC D 8 2500 367.0 367.0 35.0

TLC7725IPWR TSSOP PW 8 2000 367.0 367.0 35.0

TLC7725QDR SOIC D 8 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Oct-2013

Pack Materials-Page 2