Datasheet

TLC556, TLC556Y
DUAL LinCMOS TIMERS
SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC556Y chip information
These chips, properly assembled, display characteristics similar to the TLC556 (see electrical table). Thermal
compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted
with conductive epoxy or a gold-silicon preform.
OUT
DISCH
R1
R
S
1
RESET
CONT
V
DD
THRESH
R
R
R
GND
TRIG
(3)
(5)
(1)
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%
ALL DIMENSIONS ARE IN MILS
NO BACKSIDE METALLIZATION
PIN (7) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP
FUNCTIONAL BLOCK DIAGRAM (EACH TIMER)
(4)
(14)
(2)
(6)
(7)
61
97