Datasheet

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
5962-89503022A ACTIVE LCCC FK 20 1 None POST-PLATE Level-NC-NC-NC
5962-8950302CA ACTIVE CDIP J 14 1 None A42 SNPB Level-NC-NC-NC
TLC556CD ACTIVE SOIC D 14 50 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLC556CDG4 ACTIVE SOIC D 14 50 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLC556CDR ACTIVE SOIC D 14 2500 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLC556CDRG4 ACTIVE SOIC D 14 2500 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLC556CN ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPD Level-NC-NC-NC
TLC556CNE4 ACTIVE PDIP N 14 25 None Call TI Call TI
TLC556ID ACTIVE SOIC D 14 50 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLC556IDR ACTIVE SOIC D 14 2500 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLC556IN ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPD Level-NC-NC-NC
TLC556INE4 ACTIVE PDIP N 14 25 None Call TI Call TI
TLC556MD ACTIVE SOIC D 14 50 None CU NIPDAU Level-1-220C-UNLIM
TLC556MDR ACTIVE SOIC D 14 1 None CU NIPDAU Level-1-220C-UNLIM
TLC556MFKB ACTIVE LCCC FK 20 1 None POST-PLATE Level-NC-NC-NC
TLC556MJ ACTIVE CDIP J 14 1 None A42 SNPB Level-NC-NC-NC
TLC556MJB ACTIVE CDIP J 14 1 None A42 SNPB Level-NC-NC-NC
TLC556MN OBSOLETE PDIP N 14 None Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com
11-Mar-2005
Addendum-Page 1