Datasheet

TLC555, TLC555Y
LinCMOS TIMERS
SLFS043C – SEPTEMBER 1983 – REVISED SEPTEMBER 1997
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC555Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC555. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
50
64
RESET can override TRIG, which can override THRES.
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (1) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
GND
RESETCONT
V
DD
1
THRES
TRIG
R
R
R
DISCH
OUT
S
R
R1
(5)
(6)
(2)
(1)
(7)
(3)
(8)
(4)