Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLC555CDR SOIC D 8 2500 340.5 338.1 20.6
TLC555CPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLC555IDR SOIC D 8 2500 340.5 338.1 20.6
TLC555QDR SOIC D 8 2500 367.0 367.0 35.0
TLC555QDRG4 SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Mar-2013
Pack Materials-Page 2