Datasheet

TLC372, TLC372Q, TLC372Y
LinCMOS
DUAL DIFFERENTIAL COMPARATORS
SLCS114A – NOVEMBER 1983 – REVISED NOVEMBER 1996
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TLC372Y chip information
These chips, when properly assembled, display characteristics similar to the TLC372C. Thermal compression
or ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 3.6 × 3.6 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) INTERNALLY CONNECTED
TO
BACKSIDE
OF
CHIP.
+
1OUT
1IN+
1IN
V
CC+
(8)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN+
2IN
2OUT
(4)
GND
57
57
(3)(2)
(7)
(8)
(1)
(5)(6)
(4)