Datasheet
TLC372, TLC372Q, TLC372Y
LinCMOS
DUAL DIFFERENTIAL COMPARATORS
SLCS114A – NOVEMBER 1983 – REVISED NOVEMBER 1996
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC372Y chip information
These chips, when properly assembled, display characteristics similar to the TLC372C. Thermal compression
or ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 3.6 × 3.6 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) INTERNALLY CONNECTED
TO
BACKSIDE
OF
CHIP.
+
–
1OUT
1IN+
1IN–
V
CC+
(8)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN+
2IN–
2OUT
(4)
GND
57
57
(3)(2)
(7)
(8)
(1)
(5)(6)
(4)