Datasheet


   
SLCS114E − NOVEMBER 1983 − REVISED JULY 2008
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
equivalent schematic (each comparator)
Common to All Channels
V
DD
GND
OUT
IN + IN −
AVAILABLE OPTIONS
(1)
V max
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
(2)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
(PW)
CERAMIC
FLAT PACK
(U)
0°C to 70°C 5 mV TLC372CD — — TLC372CP TLC372CPW —
−40°C to 85°C 5 mV TLC372ID — — TLC372IP — —
−55°C to 125°C 5 mV TLC372MD TLC372MFK TLC372MJG TLC372MP — TLC372MU
−40°C to 125°C 5 mV TLC372QD — — TLC372QP — —
1.For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web
site at www.ti.com.
2.The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC372CDR).