Datasheet

TLC3702-Q1
SGLS156E –MARCH 2003–REVISED AUGUST 2012 www.ti.com
FUNCTIONAL BLOCK DIAGRAM (EACH COMPARATOR)
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
Supply voltage range, V
DD
(2)
−0.3 V to 18 V V
Differential input voltage, V
ID
(3)
±18 V
Input voltage range, V
I
−0.3 V to V
DD
V
Output voltage range, V
O
−0.3 V to V
DD
V
Input current, I
I
±5 mA
Output current, I
O
(each output) ±20 mA
Total supply current into V
DD
40 mA
Total current out of GND 40 mA
Continuous total power dissipation See Thermal Table
Operating free-air temperature range, T
A
−40 to 125 °C
Storage temperature range, T
stg
−65 to 150 °C
D package 260
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds °C
PW package 260
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to GND.
(3) Differential voltages are at IN+ with respect to IN −.
THERMAL INFORMATION
TLC3702QDRQ1 TLC3702QPWRQ1
THERMAL METRIC
(1)
UNITS
D (8 PINS) PW (8 PINS)
θ
JA
Junction-to-ambient thermal resistance 117.7 181.1
θ
JCtop
Junction-to-case (top) thermal resistance 63.9 49.9
θ
JB
Junction-to-board thermal resistance 57..8 110.1
°C/W
ψ
JT
Junction-to-top characterization parameter 15.3 2.4
ψ
JB
Junction-to-board characterization parameter 57.3 108.2
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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