Datasheet

TLC354
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS116B – SEPTEMBER 1985 – REVISED FEBRUARY 1997
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC364Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC354C. Thermal compression or
ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
JMAX
= 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
3OUT
3 IN+
3IN–
V
DD–
/GND
(10)
(9)
(8)
(11)
(14)
–
+
(13)
4IN+
4IN–
4OUT
(12)
+
–
V
DD
(3)
(4)
(7)
(6)
(5)
(1)
–
+
(2)
65
90
1IN+
1IN–
2OUT
1OUT
2IN+
2IN–
(12)
(13)
(14)
(1)
(2)
(3)
(4) (5)
(6)
(7)
(8)
(9)
(10)(11)