Datasheet
SLOS092D − SEPTEMBER 1987 − REVISED MARCH 2001
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC274Y chip information
These chips, when properly assembled, display characteristics similar to the TLC274C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO
BACK
SIDE
OF
CHIP.
+
−
1OUT
1IN+
1IN−
V
DD
(4)
(6)
(3)
(2)
(5)
(1)
−
+
(7)
2IN+
2IN−
2OUT
11
GND
+
−
3OUT
3IN+
3IN−
(13)
(10)
(9)
(12)
(8)
−
+
(14)
4OUT
4IN+
4IN−
68
108
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)(10)
(11)
(12)(13)
(14)