Datasheet

TLC252, TLC252A, TLC252B, TLC252Y, TLC25L2, TLC25L2A, TLC25L2B
TLC25L2Y, TLC25M2, TLC25M2A, TLC25M2B, TLC25M2Y
LinCMOS DUAL OPERATIONAL AMPLIFIERS
SLOS002I – JUNE 1983 – REVISED MARCH 2001
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC252Y, TLC25L2Y, and TLC25M2Y chip information
These chips, properly assembled, display characteristics similar to the TLC252/25_2. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
JMAX
= 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
1OUT
1IN+
1IN–
V
DD
V
DD–
/GND
(8)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN+
2IN–
2OUT
(4)
60
73
(2)
(1)
(8)
(7)
(6)
(5)
(3)
(4)