Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLC252CDR SOIC D 8 2500 340.5 338.1 20.6
TLC252CDR SOIC D 8 2500 367.0 367.0 35.0
TLC252CPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC25L2CDR SOIC D 8 2500 340.5 338.1 20.6
TLC25L2CPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC25M2CDR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 2