Datasheet

TLC251, TLC251A, TLC251B, TLC251Y
LinCMOS PROGRAMMABLE
LOW-POWER OPERATIONAL AMPLIFIERS
SLOS001F – JULY 1983 – REVISED MARCH 2001
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC251Y chip information
These chips, properly assembled, display characteristics similar to the TLC251C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
JMAX
= 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
OUT
BIAS SELECT
IN+
IN–
OFFSET N1
OFFSET N2
V
DD
V
DD–
/GND
(7)
(6)
(8)
(3)
(2)
(1)
(5)
(4)
48
55
(2) (1)
(8) (7)
(6)(5)(3)
(4)