Datasheet

Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TLC2274CPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
TLC2274IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
TLC2274IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
TLC2274MDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
TLC2274MDRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
TLC2274QDRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
5962-9555201NXDR SOIC D 8 2500 367.0 367.0 35.0
TLC2272ACDR SOIC D 8 2500 340.5 338.1 20.6
TLC2272ACPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC2272AIDR SOIC D 8 2500 340.5 338.1 20.6
TLC2272AMDR SOIC D 8 2500 367.0 367.0 35.0
TLC2272AMDRG4 SOIC D 8 2500 367.0 367.0 35.0
TLC2272CDR SOIC D 8 2500 340.5 338.1 20.6
TLC2272CPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC2272IDR SOIC D 8 2500 340.5 338.1 20.6
TLC2272IPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC2272MDR SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jul-2013
Pack Materials-Page 2