Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLC2272AMDREP SOIC D 8 2500 367.0 367.0 35.0
TLC2274AMDREP SOIC D 14 2500 333.2 345.9 28.6
TLC2274AMPWREP TSSOP PW 14 2000 367.0 367.0 35.0
TLC2274MDREP SOIC D 14 2500 333.2 345.9 28.6
TLC2274MPWREP TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2