Datasheet

TLC226x, TLC226xA, TLC226xY
Advanced LinCMOS
 RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS177 – FEBRUARY 1997
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC2264Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC2264C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF THE CHIP.
+
–
1OUT
1IN+
1IN–
V
DD+
(11)
(6)
(3)
(2)
(5)
(1)
(7)
(4)
–
+
2OUT
2IN+
2IN–
V
DD–
/GND
+
–
3OUT
3IN+
3IN–
(13)
(10)
(9)
(12)
(8)
(14)
–
+
4OUT
4IN+
4IN–
109
67
(1)
(2) (3)
(4)
(5) (6)
(7)
(8)
(9)(10)
(11)
(12)(13)
(14)