Datasheet
TLC226x, TLC226xA, TLC226xY
Advanced LinCMOS
RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS177 – FEBRUARY 1997
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC2262Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC2262C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO
BACKSIDE
OF
CHIP.
+
–
1OUT
1IN+
1IN–
V
DD+
(8)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN+
2IN–
2OUT
(4)
V
DD–
/GND
56
67
(1) (2) (3)
(4)
(5)
(6)
(7)(8)