Datasheet

TLC226x, TLC226xA
Advanced LinCMOS RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS177D – FEBRUARY 1997 – REVISED MARCH 2001
49
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
macromodel information
Macromodel information provided was derived using Microsim Parts, the model generation software used
with Microsim PSpice. The Boyle macromodel (see Note 5) and subcircuit in Figure 63 are generated using
the TLC226x typical electrical and operating characteristics at T
A
= 25°C. Using this information, output
simulations of the following key parameters can be generated to a tolerance of 20% (in most cases):
Maximum positive output voltage swing
Maximum negative output voltage swing
Slew rate
Quiescent power dissipation
Input bias current
Open-loop voltage amplification
Unity-gain frequency
Common-mode rejection ratio
Phase margin
DC output resistance
AC output resistance
Short-circuit output current limit
NOTE 5: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers,” IEEE Journal
of Solid-State Circuits, SC-9, 353 (1974).
OUT
+
–
+
–
+
–
+
–
+
–
+
–
+
–
+
–
+–
.SUBCKT TLC226x 1 2 3 4 5
C1 11 12 3.560E–12
C2 6 7 15.00E–12
DC 5 53 DX
DE 54 5 DX
DLP 90 91 DX
DLN 92 90 DX
DP 43DX
EGND 99 0 POLY (2) (3,0) (4,0) 0 .5 .5
FB 7 99 POLY (5) VB VC VE VLP
+ VLN 0 21.04E6 –30E6 30E6 30E6 –30E6
GA 6 0 11 12 47.12E–6
GCM 0 6 10 99 4.9E–9
ISS 3 10 DC 8.250E–6
HLIM 90 0 VLIM 1K
J1 11 2 10 JX
J2 12 1 10 JX
R2 6 9 100.0E3
RD1 60 11 21.22E3
RD2 60 12 21.22E3
R01 8 5 120
R02 7 99 120
RP 3 4 26.04E3
RSS 10 99 24.24E6
VAD 60 4 –.6
VB 9 0 DC 0
VC 3 53 DC .65
VE 54 4 DC .65
VLIM 7 8 DC 0
VLP 91 0 DC 1.4
VLN 0 92 DC 9.4
.MODEL DX D (IS=800.0E–18)
.MODEL JX PJF (IS=500.0E–15 BETA=281E–6
+ VTO=–.065)
.ENDS
V
CC+
RP
IN –
2
IN+
1
V
CC–
VAD
RD1
11
J1 J2
10
RSS ISS
3
12
RD2
60
VE
54
DE
DP
VC
DC
4
C1
53
R2
6
9
EGND
VB
FB
C2
GCM
GA
VLIM
8
5
RO1
RO2
HLIM
90
DLP
91
DLN
92
VLNVLP
99
7
Figure 63. Boyle Macromodel and Subcircuit
PSpice and Parts are trademarks of MicroSim Corporation.