Datasheet

TLC226x, TLC226xA
Advanced LinCMOS RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS177D – FEBRUARY 1997 – REVISED MARCH 2001
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC2262 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
(PW)
CERAMIC
FLATPACK
(U)
0°C to 70°C 2.5 mV TLC2262CD — — TLC2262CP TLC2262CPW —
40°Cto125°C
950
µ
V TLC2262AID — — TLC2262AIP TLC2262AIPW —
–
40°C
to
125°C
µ
2.5 mV TLC2262ID — — TLC2262IP — —
40°Cto125°C
950
µ
V TLC2262AQD — — — — —
–
40°C
to
125°C
µ
2.5 mV TLC2262QD — — — — —
–55°C to 125°C
950 µV
2.5 mV
—
—
TLC2262AMFK
TLC2262MFK
TLC2262AMJG
TLC2262MJG
—
—
—
—
TLC2262AMU
TLC2262MU
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2262CDR). The PW package is available only left-end taped
and reeled. Chips are tested at 25°C.
TLC2264 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP
(PW)
CERAMIC
FLATPACK
(W)
0°C to 70°C 2.5 mV TLC2264CD — — TLC2264CN TLC2264CPW —
40°Cto125°C
950
µ
V TLC2264AID — — TLC2264AIN TLC2264AIPW —
–
40°C
to
125°C
µ
2.5 mV TLC2264ID — — TLC2264IN — —
40
°
Cto125
°
C
950
µ
V TLC2264AQD — — — — —
–
40°C
to
125°C
µ
2.5 mV TLC2264QD — — — — —
–55°C to 125°C
950 µV
2.5 mV
—
—
TLC2264AMFK
TLC2264MFK
TLC2264AMJ
TLC2264MJ
—
—
—
—
TLC2264AMW
TLC2264MW
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2264CDR). The PW package is available only left-end taped
and reeled. Chips are tested at 25°C.