Datasheet

TLC225x, TLC225xA
Advanced LinCMOS RAIL-TO-RAIL
VERY LOW-POWER OPERATIONAL AMPLIFIERS
SLOS176D – FEBRUARY 1997 – REVISED MARCH 2001
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC2252 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
‡
(PW)
CERAMIC
FLATPACK
(U)
0°C to 70°C 1500 µV TLC2252CD — — TLC2252CP TLC2252CPW —
40°Cto125°C
850 µV TLC2252AID — — TLC2252AIP TLC2252AIPW —
–
40°C
to
125°C
µ
1500 µV
TLC2252ID — — TLC2252IP — —
40°Cto125°C
850 µV TLC2252AQD — — — — —
–
40°C
to
125°C
µ
1500 µV
TLC2252QD — — — — —
–55°C to 125°C
850 µV
1500 µV
—
—
TLC2252AMFK
TLC2252MFK
TLC2252AMJG
TLC2252MJG
—
—
—
—
TLC2252AMU
TLC2252MU
†
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2262CDR).
‡
The PW package is available only left-ended taped and reeled.
§
Chip forms are tested at 25°C only.
TLC2254 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC DIP
(N)
TSSOP
‡
(PW)
CERAMIC
FLATPACK
(W)
0°C to
70°C
1500 µV TLC2254CD — — TLC2254CN TLC2254CPW —
–40°C to 850
µ
V TLC2254AID — — TLC2254AIN
TLC2254AIPW —
125°C
µ
1500 µV
TLC2254ID — — TLC2254IN
— —
–40°C to 850
µ
V TLC2254AQD — — — — —
125°C
µ
1500 µV
TLC2254QD — — — — —
–55°C to 850 µV — TLC2254AMFK TLC2254AMJ —
— TLC2254AMW
125°C
µ
1500 µV
— TLC2254MFK TLC2254MJ —
— TLC2254MW
†
The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2254CDR).
‡
The PW package is available only left-end taped and reeled. Chips are tested at 25°C.
§
Chip forms are tested at 25°C only.