Datasheet
SLOS175B − FEBRUARY 1997 − REVISED JANUARY 2008
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC2202Y chip formation
This chip, when properly assembled, displays characteristics similar to the TLC2202C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO
BACKSIDE
OF
CHIP.
+
−
1OUT
1IN+
1IN−
V
DD+
(8)
(6)
(3)
(2)
(5)
(1)
−
+
(7)
2IN+
2IN−
2OUT
(4)
V
DD−
100
80
(1)
(2) (3)
(4)
(5)
(6)(7)(8)