Datasheet
SLOS175B − FEBRUARY 1997 − REVISED JANUARY 2008
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC2201 AVAILABLE OPTIONS
V
n
max
V
n
max
PACKAGED DEVICES
CHIP
T
A
V
IO
max
AT 25°C
V
n
max
f = 10 Hz
AT 25°C
V
n
max
f = 1 kHz
AT 25°C
SMALL
OUTLINE
†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
CHIP
FORM
‡
(Y)
200 µV
35 nV/√Hz 15 nV/√Hz
TLC2201ACD TLC2201ACP
0°C to 70°C
200 µV
30 nV/√Hz 12 nV/√Hz
TLC2201BCD
— —
TLC2201BCP
TLC2201Y
0 C to 70 C
500 µV
— —
TLC2201CD
—
—
TLC2201CP
TLC2201Y
200 µV
35 nV/√Hz 15 nV/√Hz
TLC2201AID TLC2201AIP
−40°C to 85°C
200 µV
30 nV/√Hz 12 nV/√Hz
TLC2201BID
— —
TLC2201BIP
—
−40 C to 85 C
500 µV
— —
TLC2201ID
—
—
TLC2201IP
—
200 µV
35 nV/√Hz 15 nV/√Hz
TLC2201AMD TLC2201AMFK TLC2201AMJG TLC2201AMP
−55°C to 125°C
200 µV
30 nV/√Hz 12 nV/√Hz
TLC2201BMD TLC2201BMFK TLC2201BMJG TLC2201BMP
—
−55 C to 125 C
500 µV
— —
TLC2201MD TLC2201MFK TLC2201MJG TLC2201MP
—
†
The D packages are available taped and reeled. Add R suffix to device type (e.g. TLC220xBCDR).
‡
Chip forms are tested at 25°C only.
TLC2202 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
V
n
max
f = 10 Hz
AT 25°C
V
n
max
f = 1 kHz
AT 25°C
SMALL
OUTLINE
†
(D)
PLASTIC
SMALL
OUTLINE
(PS)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
CHIP
FORM
‡
(Y)
500 µV
30 nV/√Hz 12 nV/√Hz
TLC2202BCD — — — TLC2202BCP
0°C to 70°C
500 µV
35 nV/√Hz 15 nV/√Hz
TLC2202ACD — — — TLC2202ACP
TLC2202Y
0 C to 70 C
1 mV
— —
TLC2202CD TLC2202CPSR — — TLC2202CP
TLC2202Y
500 µV
30 nV/√Hz 12 nV/√Hz
TLC2202BID — — — TLC2202BIP
−40°C to 85°C
500 µV
35 nV/√Hz 15 nV/√Hz
TLC2202AID — — — TLC2202AIP
—
−40 C to 85 C
1 mV
— —
TLC2202ID — — — TLC2202IP
—
500 µV
30 nV/√Hz 12 nV/√Hz
TLC2202BMD — TLC2202BMFK TLC2202BMJG TLC2202BMP
−55°C to 125°C
500 µV
35 nV/√Hz 15 nV/√Hz
TLC2202AMD — TLC2202AMFK TLC2202AMJG TLC2202AMP
—
−55 C to 125 C
1 mV
— —
TLC2202MD — TLC2202MFK TLC2202MJG TLC2202MP
—
†
The D packages are available taped and reeled. Add R suffix to device type (e.g. TLC220xBCDR).
‡
Chip forms are tested at 25°C only.