Datasheet

TLC1078, TLC1078Y, TLC1079, TLC1079Y
LinCMOS µPOWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS179A – FEBRUARY 1997 – REVISED MARCH 2001
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC1087Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC1078C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips can be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
+
–
1OUT
1IN+
1IN–
V
DD
V
DD–
/GND
(8)
(3)
(2)
(4)
+
–
2OUT
2IN+
2IN–
(5)
(6)
83
72
(1)
(5)
(4)
(3)
(2)
(6)
(7)
(8)
BONDING PAD ASSIGNMENTS