Datasheet

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLC080CDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TLC080CDR SOIC D 8 2500 340.5 338.1 20.6
TLC080IDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TLC080IDR SOIC D 8 2500 340.5 338.1 20.6
TLC081AIDR SOIC D 8 2500 340.5 338.1 20.6
TLC081CDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TLC081CDR SOIC D 8 2500 340.5 338.1 20.6
TLC081IDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TLC081IDR SOIC D 8 2500 340.5 338.1 20.6
TLC082AIDR SOIC D 8 2500 340.5 338.1 20.6
TLC082CDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TLC082CDR SOIC D 8 2500 340.5 338.1 20.6
TLC082IDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TLC082IDR SOIC D 8 2500 340.5 338.1 20.6
TLC083CDGQR MSOP-PowerPAD DGQ 10 2500 358.0 335.0 35.0
TLC083CDR SOIC D 14 2500 367.0 367.0 38.0
TLC084AIDR SOIC D 14 2500 367.0 367.0 38.0
TLC084AIPWPR HTSSOP PWP 20 2000 367.0 367.0 38.0
TLC084CDR SOIC D 14 2500 367.0 367.0 38.0
TLC084CPWPR HTSSOP PWP 20 2000 367.0 367.0 38.0
TLC084IDR SOIC D 14 2500 367.0 367.0 38.0
TLC084IPWPR HTSSOP PWP 20 2000 367.0 367.0 38.0
TLC085AIDR SOIC D 16 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jul-2013
Pack Materials-Page 3