Datasheet
+
−
Protection
Circuit
OUT
IN
V
ref
R1
R2
V
O
V
I
Error
Amplifier
ADJ
V
O
[ V
ref
ǒ
1 )
R2
R1
Ǔ
Absolute Maximum Ratings
(1)
Package Thermal Data
(1)
Recommended Operating Conditions
TL783
SLVS036M – SEPTEMBER 1981 – REVISED APRIL 2008 ...............................................................................................................................................
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
over operating temperature range (unless otherwise noted)
MIN MAX UNIT
V
l
– V
O
Input-to-output differential voltage 125 V
T
J
Operating virtual junction temperature 150 ° C
T
stg
Storage temperature range – 65 150 ° C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE BOARD θ
JC
θ
JP
(2)
θ
JA
PowerFLEX (KTE) High K, JESD 51-5 2.7 ° C/W 23 ° C/W
TO-263 (KTT) High K, JESD 51-5 18 ° C/W 1.94 ° C/W 25.3 ° C/W
TO-220 (KC) High K, JESD 51-5 17 ° C/W 3 ° C/W 19 ° C/W
(1) Maximum power dissipation is a function of T
J(max)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J(max)
– T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 ° C can affect reliability. Due to variations in
individual device electrical characteristics and thermal resistance, the built-in thermal overload protection may be activated at power
levels slightly above or below the rated dissipation.
(2) For packages with exposed thermal pads, such as QFN, PowerPAD™, or PowerFLEX, θ
JP
is defined as the thermal resistance between
the die junction and the bottom of the exposed pad.
MIN MAX UNIT
V
l
– V
O
Input-to-output differential voltage 125 V
I
O
Output current 15 700 mA
T
J
Operating virtual junction temperature 0 125 ° C
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