Datasheet
ABSOLUTE MAXIMUM RATINGS
(1)
PACKAGE THERMAL DATA
(1)
TL760M33 THERMAL RESISTANCE
RECOMMENDED OPERATING CONDITIONS
TL760M18-Q1
TL760M25-Q1
TL760M33-Q1
SGLS284H – OCTOBER 2005 – REVISED JULY 2009 .....................................................................................................................................................
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over operating virtual junction temperature range (unless otherwise noted)
V
I
Maximum input voltage 45 V
T
J
Operating virtual junction temperature 150 ° C
T
stg
Storage temperature range – 65 ° C to 150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE BOARD θ
JA
TO-252 (KVU) High K, JESD 51-5 30.3 ° C/W
TO-263 (KTT) High K, JESD 51-5 26.9 ° C/W
(1) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 ° C can impact reliability.
1-oz copper, one-layer PCB
THERMAL RESISTANCE VALUE
R
JA
55 ° C/W (area = 240 mm
2
)
R
JC
5.5 ° C/W from FET to tab
R
JC
0.1 ° C/W from die center to tab
MIN MAX UNIT
V
I
Input voltage
(1)
3 26 V
I
O
Output current 0 500 mA
T
J
Operating virtual-junction temperature – 40 150 ° C
(1) Minimum V
I
is equal to 3 V or V
O
(max) + 0.6 V, whichever is greater.
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